Boiling is an important phase-change heat transfer process that has attracted much attention due to the increasing demand for more efficient and compact devices.¹  Developments in technology have led to highly demanding equipment with high heat flux that needs adequate cooling to function properly. In addition, the conventional method to increase cooling in devices is to increase the heat transfer surface, which is not desirable and viable anymore in high-tech industries. Moreover, a two-phase liquid system (such as boiling) offers cooling performance that is much better than that of single-phase heat transfer modes.²  Moreover, boiling processes are capable to dissipate high heat flux at low wall superheats.