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In this chapter, a complete review of thermal characterization techniques at the chip level for both signal and energy processing microelectronic devices is presented. Critical issues related to heat generation and testability in the different technological domains are also explained in terms of shrinkage, integration density and analysis of figures of merit in radiofrequency/analog integrated circuits. Moreover, the effect of the heterogeneous integration of power and light-emission devices in energy management systems is also analysed. All these concerns are based on temperature measurements. A complete review of the available thermal characterization techniques in microelectronics is also provided. Finally, some examples of microelectronic thermal studies at the chip level for signal (low-power) and energy (medium-to-high-power) processing are presented.

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